Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
February 6, 2007
Patent Application Number
10537994
Date Filed
December 12, 2002
Patent Citations Received
Patent Primary Examiner
Patent abstract
There is provided a method for manufacturing a flat printed wiring board in which spaces between circuit patterns are filled with a resin. The method comprises: laminating via a mold release film a plurality of sets of laminated bodies formed by superposing a semi-cured resin sheet on a printed wiring board with circuit patterns formed thereon; placing the laminated plural sets of the laminated bodies interposed between a pair of smoothing plates and collectively pressing the laminated bodies in a reduced pressure atmosphere used for curing the resin; and then polishing the cured resin covering the circuit patterns, thereby exposing the circuit patterns.
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