US Patent 7164207 Wiring structure for semiconductor device
All edits
Edits on 31 Aug, 2023
Golden AI
Edits made to:
Article (+218 characters)
Article
Patent abstract
A wiring structure for semiconductor device has a wiring layer that includes copper as main component and a crystal grain promotion layer that promotes enlargement in a crystal grain of the wiring layer.
Edits on 22 May, 2023
Golden AI
Edits made to:
Infobox (-1 properties)
Infobox
Official Website
Edits on 19 May, 2023
Golden AI
Edits made to:
Infobox (+1/-1 properties)
US Patent 07164207 Wiring structure for semiconductor device US Patent 7164207 Wiring structure for semiconductor device
Infobox
Patent Number
0716420700
Patent Number
716420700
Edits on 28 Mar, 2023
Golden AI
Infobox
Is a
Patent Jurisdiction
Patent Number
071642070
Date of Patent
January 16, 2007
0Patent Application Number
107478070
Date Filed
December 30, 2003
0Official Website
Patent Primary Examiner
Edits on 27 Sep, 2022
Golden AI
Infobox
Is a
Patent Jurisdiction
Patent Number
071642070
Date of Patent
January 16, 2007
0Patent Application Number
107478070
Date Filed
December 30, 2003
0Official Website
Patent Primary Examiner
Edits on 8 Jun, 2022
Golden AI
Edits made to:
Infobox (+1 properties)
Infobox
Website URL
Edits on 20 Nov, 2021
Golden AI
Edits made to:
Infobox (+7 properties)
US Patent 07164207 Wiring structure for semiconductor device
Infobox
Is a
Patent jurisdiction
Patent number
07164207
Date of patent
January 16, 2007
Patent application number
10747807
Date Filed
December 30, 2003
Patent primary examiner
Find more entities like US Patent 7164207 Wiring structure for semiconductor device
Use the Golden Query Tool to find similar entities by any field in the Knowledge Graph, including industry, location, and more.
By using this site, you agree to our Terms of Service.