Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
January 16, 2007
Patent Application Number
10929373
Date Filed
August 31, 2004
Patent Primary Examiner
Patent abstract
In a semiconductor device including a semiconductor wafer having a first main surface where a circuit element is formed, electrode pads are formed at an upper portion of the first main surface of the semiconductor wafer electrically connected with the circuit element. Index marks are formed on a second main surface of the semiconductor wafer that is opposite the first main surface. The index marks consist of line segments and indicate a direction along which the semiconductor device is to be mounted.
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