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US Patent 7161808 Retaining heat sinks on printed circuit boards

Patent 7161808 was granted and assigned to Intel on January, 2007 by the United States Patent and Trademark Office.

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Patent attributes

Current Assignee

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Patent Jurisdiction

United States Patent and Trademark Office

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Patent Number

Patent Inventor Names

Robert R. Atkinson0

Date of Patent

January 9, 2007

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Patent Application Number

108044130

Date Filed

March 19, 2004

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Patent Citations Received

US Patent 11758690 Heat-dissipation device allowing easy detachment from heat-generating component

Patent Primary Examiner

Michael Datskovsky

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Patent abstract

A heat sink assembly may be plugged into a receiving element in a printed circuit board. A retention element includes upper and lower portions. The lower portion may be plug locked onto a printed circuit board. The upper portion then telescopes into and releaseably locks in the lower portion. The upper portion may include a rod which may be rotated to free the upper portion from the lower portion for disassembly.

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