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US Patent 7160931 Thermally reversible implant and filler

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Is a
Patent
Patent

Patent attributes

Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent Number
7160931
Date of Patent
January 9, 2007
Patent Application Number
10428520
Date Filed
May 2, 2003
Patent Citations Received
‌
US Patent 11904068 Occlusive implant compositions
0
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US Patent 11911532 Reverse thermal gels and their use as vascular embolic repair agents
0
‌
US Patent 11951032 Systems and methods for delivering biomaterials
0
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US Patent 11957616 Systems and methods for delivering biomaterials
0
Patent Primary Examiner
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Tae H. Yoon
Patent abstract

The invention relates to the use of a thermal reversible gel, such as a copolymer composition, as a biological filler or implant. The gel has a semi-solid form at body temperature, but upon cooling to a temperature below a threshold level, the gel is liquefied and can be re-shaped, re-sized, manipulated or removed from the body. The gel may be used as a subcutaneous implant, a biological filler, joint or tissue spacer, for wrinkle filling or other cosmetic implants, as a soft-tissue replacement for reconstructive surgery, or as a barrier within the lumen of a biological structure, such as a blood vessel. The implant may be used to provide reversible birth control by providing, for example, a reversible barrier to the cervix or a reversible blockage of the lumen of the vas deferens.

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