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US Patent 7157587 Imide-extended liquid bismaleimide resin

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
0
Date Filed
April 30, 2004
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Date of Patent
January 2, 2007
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Patent Application Number
10836367
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Patent Citations Received
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US Patent 11753499 Curable resin composition, adhesive, imide oligomer, imide oligomer composition, and curing agent
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US Patent 11945913 Thermosetting polyimide resin and manufacturing method thereof, composition, prepolymer, film, adhesive, and use thereof
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US Patent 11802177 Curable resin composition, adhesive, imide oligomer, imide oligomer composition, and curing agent
Patent Inventor Names
Farhad G. Mizori
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Stephen M. Dershem
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Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
7157587
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Patent Primary Examiner
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Fiona T. Powers
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