US Patent 7154185 Encapsulation method for SBGA
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Patent abstract
A method for encapsulating an integrated circuit chip is described. An intergrated circuit chip is attached to a substrate; a stress buffering material only covers corners of the integrated circuit chip; and an encapsulation material coats the integated circuit chip and a portion of the substrate.
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US Patent 07154185 Encapsulation method for SBGA US Patent 7154185 Encapsulation method for SBGA
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Patent Number
0715418500
Patent Number
715418500
Edits on 20 May, 2023
Golden AI
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Official Website
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Infobox
Is a
Patent Jurisdiction
Patent Number
071541850
Date of Patent
December 26, 2006
0Patent Application Number
107181910
Date Filed
November 20, 2003
0Official Website
Patent Primary Examiner
Edits on 24 Sep, 2022
Golden AI
Infobox
Is a
Patent Jurisdiction
Patent Number
071541850
Date of Patent
December 26, 2006
0Patent Application Number
107181910
Date Filed
November 20, 2003
0Official Website
Patent Primary Examiner
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Golden AI
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US Patent 07154185 Encapsulation method for SBGA
Infobox
Is a
Patent jurisdiction
Patent number
07154185
Date of patent
December 26, 2006
Patent application number
10718191
Date Filed
November 20, 2003
Patent primary examiner
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