US Patent 7153369 Method of chemical mechanical polishing

Patent 7153369 was granted and assigned to JSR Corporation on December, 2006 by the United States Patent and Trademark Office.

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Is a

Patent

Patent attributes

Current Assignee

JSR Corporation

Patent Jurisdiction

United States Patent and Trademark Office

Patent Number

7153369

Date of Patent

December 26, 2006

Patent Application Number

10200504

Date Filed

July 23, 2002

Patent Primary Examiner

‌

Daniel S. Metzmaier

Patent abstract

It is an object of the invention to provide an aqueous dispersion for CMP that produces no scratches on polishing surfaces and that polishes with an adequate rate, when used for polishing of copper and the like. The aqueous dispersion of the invention contains water and polymer particles composed of a polymer with a specific functional group, and it may also contain a complexing agent, a compound that forms a passivation film on polishing surfaces and/or an oxidizing agent. The specific functional group is a functional group that can react with the metals of polishing surfaces or that can form a cation, and it is preferably selected from among amino, pyridyl and acrylamide groups. The polymer can be obtained using a initiator and/or monomer possessing the specific functional group. The polymer may also have a crosslinked structure.