US Patent 7148578 Semiconductor multi-chip package

Patent 7148578 was granted and assigned to Samsung on December, 2006 by the United States Patent and Trademark Office.

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Is a

Patent

Patent attributes

Current Assignee

Samsung

Patent Jurisdiction

United States Patent and Trademark Office

Patent Number

71485780

Date of Patent

December 12, 2006

Patent Application Number

106518130

Date Filed

August 28, 2003

Patent Primary Examiner

‌

Alexander Oscar Williams

Patent abstract

A semiconductor chip comprises a semiconductor substrate having integrated circuits formed on a cell region and a peripheral circuit region adjacent to each other. A bond pad-wiring pattern is formed on the semiconductor substrate. A pad-rearrangement pattern is electrically connected to the bond pad-wiring pattern. The pad-rearrangement pattern includes a bond pad disposed over at least a part of the cell region. The bond pad-wiring pattern is formed substantially in a center region of the semiconductor substrate. Thus, with the embodiments of the present invention, the overall chip size can thereby be substantially reduced and an MCP can be fabricated without the problems mentioned above.