US Patent 7145226 Scalable microelectronic package using conductive risers
Patent 7145226 was granted and assigned to Intel on December, 2006 by the United States Patent and Trademark Office.
Is a
Current Assignee
Date Filed
June 30, 2003
Date of Patent
December 5, 2006
Patent Application Number
10610854
Patent Jurisdiction
Patent Number
Patent Primary Examiner
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