Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Chao-Fu Weng0
Date of Patent
December 5, 2006
0Patent Application Number
108742370
Date Filed
June 24, 2004
0Patent Primary Examiner
Patent abstract
A bumping process mainly comprises the steps of providing a wafer having a plurality of bonding pads, forming a patterned adhesive layer over the bonding pads, forming a barrier layer and a wetting layer on the patterned adhesive layer and the surface of the wafer, removing the barrier layer and the wetting layer not covering the patterned adhesive layer, forming a plurality of bumps on the patterned wetting layer and reflowing the bumps.
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