Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Tetsuya Ueda0
Eiji Tamaoka0
Hideo Nakagwa0
Masafumi Kubota0
Date of Patent
December 5, 2006
Patent Application Number
10958282
Date Filed
October 6, 2004
Patent Primary Examiner
Patent abstract
A semiconductor device includes metal interconnects made from a multi-layer film composed of a first metal film formed on a semiconductor substrate with an insulating film sandwiched therebetween and a second metal film deposited on the first metal film. An interlayer insulating film having a via hole is formed on the metal interconnects. A third metal film is selectively grown on the second metal film within the via hole, so that a plug can be formed from the third metal film.
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