Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
December 5, 2006
0Patent Application Number
100684000
Date Filed
February 6, 2002
0Patent Primary Examiner
Patent abstract
A bonding method and apparatus for performing same in which a first member (e.g., a silicon chip) is bonded to a second member (e.g., a glass substrate such as a PCB) using a thermosetting resin adhesive. Near infrared rays are directed onto the second member, some of these passing through the second member to also heat the adhesive. A heater is pressed onto the first member and also heats the first member. Selective cooling is also utilized to assure an acceptable temperature gradient between both members and thereby prevent distortion of same which could harm the resulting structure.
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