A mold member 5 packaging a capacitor element 2 is in the form of a generally rectangular parallelepiped whose length L is greater than the width W and the height H. The mold member 5 includes an opposite pair of side surfaces extending in the direction of the length L, and an anode lead terminal 3 is arranged at an anode-side one 5a of the longitudinally-extending side surfaces, whereas a cathode terminal 4 is arranged at a cathode-side one 5b of the longitudinally-extending side surfaces. The chip body 6 is in the form of a generally rectangular parallelepiped elongated in the direction of the length L of the mold member 5. The lead terminals 3 and 4 are elongated in the direction of the length L of the mold member 5. Of an opposite pair of longitudinally-extending side surfaces of the chip body 6, an anode side one 6a is provided with a plurality of anode bars 7 juxtaposed and projecting therefrom. The capacitor element 2 is arranged between the lead terminals 3 and 4 so that the orientation C1 corresponds to the direction of the width W of the mold member 5.