Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Kaname Ozawa0
Takaaki Suzuki0
Kazuyuki Aiba0
Yasurou Matsuzaki0
Tetsuya Hiraoka0
Akira Takashima0
Date of Patent
November 21, 2006
0Patent Application Number
110066640
Date Filed
December 8, 2004
0Patent Primary Examiner
Patent abstract
A semiconductor chip is secured in a state deformed into a substantially cylinder shape by a coating material formed on its surface. The deformed semiconductor chip is flip-chip connected to an interposer and sealed with sealing resin onto the interposer. Solder balls are provided, as external terminals, on the other side of the interposer.
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