Is a
Patent attributes
Current Assignee
Patent Jurisdiction
Patent Number
Date of Patent
November 21, 2006
Patent Application Number
10850912
Date Filed
May 21, 2004
Patent Primary Examiner
Patent abstract
A thermoplastic molding composition comprising polyamide is disclosed. The composition that contains vinyl (co)polymer and an optional solvent is useful in application where inhibited crystallization of polyamide is desirable, including laser-welding.
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