US Patent 7137441 End surface capillary structure of heat pipe

An end-surface wick structure of a heat pipe provided by the present invention has a pipe member and a wick structure. The wick structure has at least one woven mesh to be attached to an internal sidewall of the pipe member and one sintering powder attached to an internal surface of a bottom lid covering a bottom end of the pipe member. Thereby, the sintering powder can be attached to bottom corners of the pipe member to improve heat transfer and conduction of the heat pipe.