US Patent 7137440 Heat sink for electronic device

A heat sink has a substrate with first pivoting portions thereon. A heat scattering member has a plurality of fins on a top thereof, a protrusion on a periphery thereof and a pressing portion between the protrusion and the distal fin. A clip member has connection portions, second pivoting portions and a lock portion. The second pivoting portions are projected from ends of the connection portions to be pivotally connected to the first pivoting portions of the substrate. The clip member is moved between a fist position and a second position. The lock portions are projected from the other ends of the connection portions to be engaged with the pressing portions while the lock portion is moved to the second position.