Is a
Patent attributes
Current Assignee
Patent Jurisdiction
Patent Number
Date of Patent
November 21, 2006
Patent Application Number
10896271
Date Filed
July 20, 2004
Patent Primary Examiner
Patent abstract
Methods for fabricating semiconductor device components include use of programmed material consolidation processes to form the substrates or conductive elements thereof. The features that are formed by such processes may include multiple adjacent, mutually adhered regions. A machine vision system may be used so that the programmed material consolidation system may recognize the position, orientation, and features of a semiconductor device assembly, semiconductor die, or other substrate on which an element is to be fabricated.
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