Patent attributes
A label for use as an in-mold label and including a radio frequency identification device (RFID) is disclosed. The label includes an RFID having opposed first and second surfaces; a first layer of heat-activated adhesive disposed on the first surface of the RFID; a second layer of heat-activated adhesive disposed on the second surface of the RFID; and a surface layer comprising a polymeric film disposed on a surface of the first layer of heat-activated adhesive opposite the first surface of the RFID. The label is placed in a mold with the surface layer contacting the mold. A polymer is molded in the mold such that the second layer of heat-activated adhesive (or a surface layer over the second layer of heat-activated adhesive) adheres to the polymer thereby producing a labeled article that can be identified using the radio frequency identification device in the label.
