Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Shinya Takyu0
Ninao Sato0
Date of Patent
November 14, 2006
0Patent Application Number
107872070
Date Filed
February 27, 2004
0Patent Primary Examiner
Patent abstract
A semiconductor element is formed in a semiconductor wafer, and a groove is formed by performing half-cut dicing on the semiconductor wafer along a dicing line. A dicing region of the semiconductor wafer is irradiated with a laser beam to melt or vaporize a cutting streak formed by dicing. An adhesive tape is adhered to the semiconductor element formation surface of the semiconductor wafer, and the other side of the semiconductor element formation surface is ground to at least a depth reaching the groove.
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