US Patent 7115989 Adhesive sheet for producing a semiconductor device
Patent 7115989 was granted and assigned to Nitto Denko on October, 2006 by the United States Patent and Trademark Office.
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An adhesive sheet for producing a semiconductor device, which includes a base layer and an adhesive layer and is used in the process for producing the semiconductor device including the step of sealing a semiconductor element connected to an electric conductor with a sealing resin on the adhesive layer, wherein the adhesive layer of the adhesive sheet includes a rubber component and an epoxy resin component and the ratio of the rubber component in organic materials in the adhesive layer is from 5 to 40% by weight. According to this adhesive sheet, pollution is not caused by silicon components, a sufficient elastic modulus can be kept even at high temperature, and a problem that paste remains is not easily caused.
US Patent 07115989 Adhesive sheet for producing a semiconductor device US Patent 7115989 Adhesive sheet for producing a semiconductor device
US Patent 07115989 Adhesive sheet for producing a semiconductor device
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