Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Homayoun Talieh0
Bulent M. Basol0
Cyprian E. Uzoh0
Date of Patent
October 3, 2006
0Patent Application Number
109961640
Date Filed
November 22, 2004
0Patent Primary Examiner
Patent abstract
The present invention relates to a process for forming a near-planar or planar layer of a conducting material, such as copper, on a surface of a workpiece using an ECMPR technique. The process preferably uses at least two separate plating solution chemistries to form a near-planar or planar copper layer on a semiconductor substrate that has features or cavities on its surface.
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