Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Masahiko Hasunuma0
Date of Patent
September 26, 2006
0Patent Application Number
110286640
Date Filed
January 5, 2005
0Patent Primary Examiner
Patent abstract
A semiconductor device is provided, the semiconductor device including a semiconductor chip having a first metal heat-conductive medium in the inside thereof, a substrate having a second metal heat-conductive medium thermally connected to the first metal heat-conductive medium, and a temperature control device of which at least a part is disposed on the substrate, thermally connected to the second metal heat-conductive medium, and configured to control the temperature within the semiconductor chip.
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