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US Patent 7112808 Wafer 2D scan mechanism

Patent 7112808 was granted and assigned to Axcelis Technologies on September, 2006 by the United States Patent and Trademark Office.

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Patent
Patent

Patent attributes

Current Assignee
Axcelis Technologies
Axcelis Technologies
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent Number
7112808
Patent Inventor Names
Michael Ioannou0
Joseph Ferrara0
Mehran Asdigha0
Date of Patent
September 26, 2006
Patent Application Number
10786660
Date Filed
February 25, 2004
Patent Primary Examiner
‌
NIkita Wells
Patent abstract

The present invention is directed to a scanning apparatus and method for processing a substrate, wherein the scanning apparatus comprises a base portion and a rotary subsystem. The rotary subsystem comprises a first link comprising a first joint, wherein the first link is rotatably coupled to the base portion by the first joint, and a second link comprising a second joint, wherein the second link is rotatably coupled to the first link by the second joint. The first joint and the second joint are spaced a predetermined distance from one another. The second link further comprising an end effector whereon the substrate resides, and wherein the end effector is operably coupled to the second link. The end effector is further spaced from the second joint by the predetermined distance, wherein a rotation of the first link and second link in a respective first direction and second direction is operable to linearly oscillate the end effector along a linear first scan path, and wherein the rotational velocity of the first link and second link does not cross zero.

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