Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Kiyoshi Sawada0
Akira Itoh0
Date of Patent
September 26, 2006
0Patent Application Number
110837910
Date Filed
March 18, 2005
0Patent Primary Examiner
Patent abstract
A molding device includes a lower mold unit and an upper mold unit. A molding cavity is defined between the mold units. The lower mold unit has a storing chamber connected to the molding cavity. The upper mold unit has a damper chamber connected to the molding cavity. A pressurizing rod is inserted into the damper chamber. The pressurizing rod is actuated by a cylinder. When a pushing rod pushes molten metal in the storing chamber to the cavity, an excess amount of the molten metal enters the damper chamber. Therefore, the molding operation is reliably performed even if an excessive amount of molten metal is injected into the storing chamber. Further, the pressurizing rod pressurizes the excess amount of metal in the damper chamber.
Timeline
No Timeline data yet.
Further Resources
No Further Resources data yet.