US Patent 7108744 Tape joint compounds with CMC thickener system
All edits
Edits on 6 Sep, 2023
Golden AI
Edits made to:
Infobox (+1 properties)
Infobox
Patent Inventor Names
Thomas J. Podlas0
Edits on 31 Aug, 2023
Golden AI
Edits made to:
Article (+357 characters)
Article
Patent abstract
CMC with CMDS greater than or equal to 0.76, optionally with a non-ionic co-thickener or a CMC with CMDS less than 0.75 is used as both the rheology modifier and partial clay substitute in tape joint compounds. This significant reduction of clay level is sufficient to eliminate most of the negative characteristics of clay in joint compound.
Edits on 15 Jul, 2023
Golden AI
Edits made to:
Infobox (+1/-1 properties)
US Patent 07108744 Tape joint compounds with CMC thickener system US Patent 7108744 Tape joint compounds with CMC thickener system
Infobox
Patent Number
071087440
Patent Number
71087440
Edits on 25 May, 2023
Golden AI
Edits made to:
Infobox (-1 properties)
Infobox
Official Website
Edits on 27 Sep, 2022
Golden AI
Infobox
Is a
Patent Jurisdiction
Patent Number
071087440
Date of Patent
September 19, 2006
0Patent Application Number
109398150
Date Filed
September 13, 2004
0Official Website
Patent Primary Examiner
Edits on 7 Jun, 2022
Golden AI
Edits made to:
Infobox (+1 properties)
Infobox
Website URL
Edits on 17 Nov, 2021
Golden AI
Edits made to:
Infobox (+7 properties)
US Patent 07108744 Tape joint compounds with CMC thickener system
Infobox
Is a
Patent jurisdiction
Patent number
07108744
Date of patent
September 19, 2006
Patent application number
10939815
Date Filed
September 13, 2004
Patent primary examiner
Find more entities like US Patent 7108744 Tape joint compounds with CMC thickener system
Use the Golden Query Tool to find similar entities by any field in the Knowledge Graph, including industry, location, and more.
By using this site, you agree to our Terms of Service.