Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
September 12, 2006
Patent Application Number
11113570
Date Filed
April 25, 2005
Patent Primary Examiner
Patent abstract
A method of manufacturing a semiconductor device having a build-up layer for wiring between semiconductor elements and external connection terminals is disclosed. The method comprises steps of forming a rewiring layer on a wafer, placing the wafer on a stretchable dicing tape, dicing the wafer placed on the dicing tape, forming a clearance between adjacent semiconductor elements by stretching the dicing tape, forming a semiconductor device continuous body by forming a build-up layer on the semiconductor elements and the clearance, and forming semiconductor devices by dicing the semiconductor device continuous body.
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