US Patent 7102876 Structure of an interleaving striped capacitor substrate
Patent 7102876 was granted and assigned to Industrial Technology Research Institute on September, 2006 by the United States Patent and Trademark Office.
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An interleaving striped capacitor substrate structure for pressing-type print circuit boards is disclosed. To meet the high-frequency, high-speed, and high-density requirements in modern electronic systems, the interleaving striped capacitor substrate structure uses several dielectric materials of different dielectric coefficients to make a dielectric layer. One dielectric layer can be stacked on another to form a multi-layered capacitor substrate so that a single capacitor substrate can provide the highest capacitance required for the decoupling capacitor to suppress high-frequency noise signals, and the lower dielectric coefficient substrate required for high-speed signal transmission. This simultaneously achieves the effects of reducing high-frequency transmission time and suppressing high-frequency noise.
US Patent 07102876 Structure of an interleaving striped capacitor substrate US Patent 7102876 Structure of an interleaving striped capacitor substrate
US Patent 07102876 Structure of an interleaving striped capacitor substrate
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