US Patent 7098541 Interconnect method for directly connected stacked integrated circuits

A method and related configuration for stacking and interconnecting multiple identical integrated circuit semiconductor die. A die designed in accordance with the present invention can be directly interconnected with other identical die by placing a second die on a first die. The second die is substantially identical to the first die and has a rotation with respect to the first die. A plurality of electrical interconnections on the first die are contacted with a plurality of electrical interconnections on the second die, forming electrical interconnects between adjacent stacked dies.