Patent attributes
A susceptor including a substrate support and a conductor is provided. The substrate support includes a conductive element, a contact bonded to the conductive element, and a bushing. The conductor is disposed through the bushing and is bonded to the contact. The substrate support can also include a conductive spreader between the contact and the conductive element. A method for fabricating a susceptor is also provided. The method comprises forming a plate including a bushing preform, sintering or hot-pressing a conductive element and a contact between a ceramic layer and the plate to produce a substrate support, forming a conductor opening into the substrate support and through the bushing preform to the contact, and bonding a conductor into the conductor opening.
