Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Chih-Hsiang Yao0
Kuan-Shou Chi0
Tai-Chun Huang0
Date of Patent
August 29, 2006
0Patent Application Number
107610040
Date Filed
January 20, 2004
0Patent Citations Received
Patent Primary Examiner
Patent abstract
A method to singulate a circuit die from an integrated circuit wafer is achieved. The method comprises providing an integrated circuit wafer containing a circuit die. The integrated circuit wafer is cut through by performing a single, continuous cut around the perimeter of the circuit die to thereby singulate the circuit die.
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