US Patent 7096393 Built-in self-test (BIST) of memory interconnect

Disclosed are novel methods and apparatus for efficiently providing instruction-based BIST of memory interconnects. In an embodiment of the present invention, a method of testing a memory interconnect between an external memory module and a chip is disclosed. The method includes: providing an on-chip memory controller coupled to the external memory module, the on-chip memory controller sending and receiving data to and from the external memory module; providing an on-chip built-in self-test (BIST) module coupled to the on-chip memory controller, the BIST module including an instruction register to store a plurality of instructions; testing the external memory module; and once the external memory module has successfully passed the testing, utilizing the external memory module in testing the memory interconnect.