Patent attributes
A method of forming a ceramic structure includes disposing substrate-forming ceramic green sheets having conductors, internal conductors, and via conductors so as to sandwich connecting member-forming ceramic green sheets having via conductors, followed by lamination and bonding thereof by pressure application, with the conductors being formed using a conductive paste primarily composed of a powdered metal, so that a ceramic laminate composed of ceramic molded bodies laminated to each other is formed. The ceramic laminate is fired at a temperature at which the substrate-forming ceramic green sheets are sintered and the connecting member-forming ceramic green sheets are not sintered and at a temperature not more than the melting point of the metal, and subsequently, the connecting member-forming ceramic green sheets are removed from the fired composite laminate, thereby forming a ceramic structure.
