Is a
Patent attributes
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Tianhong Cui1
Yongjun Zhao1
Jing Wang1
Date of Patent
August 22, 2006
1Patent Application Number
106489271
Date Filed
August 27, 2003
1Patent Primary Examiner
Patent abstract
A process for fabricating a polymer based circuit by the following steps. A mold of a design is formed through a lithography process. The design is transferred to a polymer substrate through a hot embossing process. A metal layer is then deposited over at least part of said design and at least one electrical lead is connected to said metal layer.
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