US Patent 7087538 Method to fill the gap between coupled wafers
Patent 7087538 was granted and assigned to Intel on August, 2006 by the United States Patent and Trademark Office.
Is a
Current Assignee
Date Filed
August 16, 2004
Date of Patent
August 8, 2006
Patent Application Number
10919550
Patent Citations Received
Patent Jurisdiction
Patent Number
Patent Primary Examiner
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