US Patent 7087497 Low-thermal-budget gapfill process

Patent 7087497 was granted and assigned to Applied Materials on August, 2006 by the United States Patent and Trademark Office.

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Is a

Patent

Patent attributes

Current Assignee

Applied Materials

Patent Jurisdiction

United States Patent and Trademark Office

Patent Number

7087497

Date of Patent

August 8, 2006

Patent Application Number

10793559

Date Filed

March 4, 2004

Patent Primary Examiner

‌

Thao P. Le

Patent abstract

A low-thermal-budget gapfill process is provided for filling a gap formed between two adjacent raised features on a strained-silicon substrate as part of a shallow-trench-isolation process. An electrically insulating liner is deposited using atomic-layer deposition and polysilicon is deposited over the electrically insulating liner, with both stages being conducted at temperatures below 700° C.