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US Patent 7067335 Apparatus and methods for semiconductor IC failure detection

Patent 7067335 was granted and assigned to KLA-Tencor on June, 2006 by the United States Patent and Trademark Office.

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Patent
Patent
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Patent attributes

Current Assignee
KLA-Tencor
KLA-Tencor
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Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
70673350
Patent Inventor Names
Gaurav Verma0
Kurt H. Weiner0
Date of Patent
June 27, 2006
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Patent Application Number
102646250
Date Filed
October 2, 2002
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Patent Citations Received
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US Patent 12072376 Die-to-die connectivity monitoring
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US Patent 11929131 Memory device degradation monitoring
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US Patent 12013800 Die-to-die and chip-to-chip connectivity monitoring
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US Patent 12123908 Loopback testing of integrated circuits
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US Patent 12092684 Integrated circuit workload, temperature, and/or sub-threshold leakage sensor
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US Patent 11841395 Integrated circuit margin measurement and failure prediction device
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Patent Primary Examiner
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Hoai Pham
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Patent abstract

An improved voltage contrast test structure is disclosed. In general terms, the test structure can be fabricated in a single photolithography step or with a single reticle or mask. The test structure includes substructures which are designed to have a particular voltage potential pattern during a voltage contrast inspection. For example, when an electron beam is scanned across the test structure, an expected pattern of intensities are produced and imaged as a result of the expected voltage potentials of the test structure. However, when there is an unexpected pattern of voltage potentials present during the voltage contrast inspection, this indicates that a defect is present within the test structure. To produce different voltage potentials, a first set of substructures are coupled to a relatively large conductive structure, such as a large conductive pad, so that the first set of substructures charges more slowly than a second set of substructures that are not coupled to the relatively large conductive structure. Mechanisms for fabricating such a test structure are also disclosed. Additionally, searching mechanisms for quickly locating defects within such a test structure, as well as other types of voltage contrast structures, during a voltage contrast inspection are also provided.

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