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US Patent 7064391 Bond and back side etchback transistor fabrication process

Patent 7064391 was granted and assigned to Xilinx on June, 2006 by the United States Patent and Trademark Office.

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US Patent 12129168 Microelectronics package with vertically stacked MEMS device and controller device
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US Patent 12125825 RF devices with enhanced performance and methods of forming the same
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US Patent 12112999 RF devices with enhanced performance and methods of forming the same
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US Patent 12080683 RF devices with enhanced performance and methods of forming the same
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US Patent 12062571 Selective etching process for SiGe and doped epitaxial silicon
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US Patent 12009330 RF devices with enhanced performance and methods of forming the same
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US Patent 11996388 RF devices with enhanced performance and methods of forming the same
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