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US Patent 7062849 Method for producing circuitry using molten metal droplets

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Is a
Patent
Patent
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Patent attributes

Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
0
Patent Number
70628490
Patent Inventor Names
Hitoshi Ushijima0
Hitoshi Ohashi0
Kinya Horibe0
Date of Patent
June 20, 2006
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Patent Application Number
102615810
Date Filed
October 2, 2002
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Patent Citations Received
‌
US Patent 12090565 Systems for printing three-dimensional objects
0
‌
US Patent 11853033 Systems and methods for using wire printing process data to predict material properties and part quality
0
Patent Primary Examiner
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Richard Chang
0
Patent abstract

A method for producing a circuitry includes steps of providing first coordinate data of at least one of positions, shapes and intervals of patterns of a first circuit, and jetting droplets of molten metal on a substrate so as to form the first circuit based on the coordinate data.

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