US Patent 7060761 Epoxy resin compositions
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Patent abstract
An epoxy resin composition comprising (i) a compound having at least two epoxy groups in a molecule as a main component, (ii) a fluorene skeleton-bearing, silicone-modified phenolic resin as a curing agent, and (iii) an organophosphorus compound, amine compound or imidazole compound as a cure accelerator cures into an elastomeric product having a low elasticity, toughness and low dielectric properties.
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Patent Inventor Names
Hideto Kato0
Kazuhiro Arai0
Satoshi Asai0
Date of Patent
June 13, 2006
0Patent Application Number
106396230
Date Filed
August 13, 2003
0Patent Primary Examiner
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US Patent 7060761 Epoxy resin compositions
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