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US Patent 7054136 Controlled ESR low inductance multilayer ceramic capacitor

Patent 7054136 was granted and assigned to AVX Corporation on May, 2006 by the United States Patent and Trademark Office.

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Is a
Patent
Patent
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Patent attributes

Current Assignee
AVX Corporation
AVX Corporation
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Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
70541360
Patent Inventor Names
Andrew P. Ritter0
John L. Galvagni0
Date of Patent
May 30, 2006
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Patent Application Number
104464640
Date Filed
May 28, 2003
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Patent Citations Received
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US Patent 12071364 Glass ceramic articles having improved properties and methods for making the same
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US Patent 11916073 Stacked complementary field effect transistors
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US Patent 12071367 Glass substrates including uniform parting agent coatings and methods of ceramming the same
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US Patent 12081169 System and method for mixing radiofrequency signals
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US Patent 12077464 Setter plates and methods of ceramming glass articles using the same
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US Patent 11834363 Methods for ceramming glass with nucleation and growth density and viscosity changes
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US Patent 11869893 Stacked field effect transistor with wrap-around contacts
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Patent Primary Examiner
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Eric W Thomas
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Patent abstract

A multilayer ceramic capacitor assembly capable of exhibiting low high-frequency inductance and a controlled equivalent series resistance (ESR) while maintaining a useful capacitance value includes respective pluralities of first and second electrode elements interleaved to form a stack. Controlled ESR is achieved either through inclusion of specific types of materials or through alteration of the shape of various component parts. A resistive material may be used in typical end terminations, via terminations, electrode elements or connective tab structures. Additionally, the dielectric may be made lossy so as to enhance resistivity without overly affecting device capacitance. Still further, an additional layer of resistive material may be added to an outer device surface to connect filled-via terminations to end terminations or radial resistive prints may be used to only partially fill the vias. Finally, various electrode element configurations, such as flat plate, serpentine, mesh, L-, O- or U-shaped patterns, may be employed.

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