US Patent 7038309 Chip package structure with glass substrate
Patent 7038309 was granted and assigned to VIA Technologies on May, 2006 by the United States Patent and Trademark Office.
Is a
Current Assignee
Date Filed
August 15, 2003
0
Date of Patent
May 2, 2006
0
Patent Application Number
10643788
0
Patent Citations Received
Patent Inventor Names
Chi-Hsing Hsu
0
Kenny Chang
0
Patent Jurisdiction
Patent Number
Patent Primary Examiner
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