US Patent 7026654 Package for optical semiconductor
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Patent abstract
To provide a package for an optical semiconductor having a light-emitting device and a light-receiving device in one package, in which a groove is provided between the light-emitting device and the light-receiving device to thereby avoid rays of light from the light-emitting device to directly enter the light-receiving device.
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Patent Inventor Names
Akio Atsuta0
Makoto Ogura0
Masahiko Igaki0
Tadashi Kosaka0
Date of Patent
April 11, 2006
0Patent Application Number
104069430
Date Filed
April 3, 2003
0Patent Primary Examiner
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US Patent 7026654 Package for optical semiconductor
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