Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Hideaki Oka0
Hideharu Matsuoka0
Toru Kuki0
Date of Patent
March 7, 2006
0Patent Application Number
104644740
Date Filed
June 19, 2003
0Patent Citations Received
Patent Primary Examiner
Patent abstract
Provided is a polyamide composition comprising 100 parts by weight of (A) a polyamide having dicarboxylic acid units containing 60 to 100 mol % of terephthalic acid units, and diamine units containing 60 to 100 mol % of 1,9-nonanediamine units and/or 2-methyl-1,8-octanediamine units, and 5 to 100 parts by weight of (B) a titanium oxide with an average particle size of 0.1 to 0.5 μm. The polyamide composition shows excellent heat resistance enough to withstand the SMT process, and gives a molded article with excellent whiteness and surface-reflectance.
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