Is a
Patent attributes
Patent Applicant
0
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Gary Hua0
Marshall Miles0
Date of Patent
September 27, 2005
0Patent Application Number
104387210
Date Filed
May 15, 2003
0Patent Primary Examiner
Patent abstract
An electronic device has three dimensional surface features molded into an encapsulant forming an electronic package. The electronic package has improved heat transfer compared to conventional electronic devices. The three dimensional features are designed to be moldable.
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