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US Patent 6926585 Pressure control system and polishing apparatus

Patent 6926585 was granted and assigned to Ebara Corporation on August, 2005 by the United States Patent and Trademark Office.

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Patent
Patent
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Patent attributes

Patent Applicant
0
Current Assignee
Ebara Corporation
Ebara Corporation
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Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
69265850
Patent Inventor Names
Tetsuji Togawa0
Date of Patent
August 9, 2005
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Patent Application Number
109353020
Date Filed
September 8, 2004
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Patent Citations Received
‌
US Patent 11931857 Deformable substrate chuck
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Patent Primary Examiner
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Joseph J. Hail, III
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Patent abstract

A pressure control system is used for eliminating individual differences of a plurality of pressure controllers used for controlling pressures of a plurality of pressure-controlled sections. The pressure control system includes a plurality of pressure controllers for supplying a pressurized fluid to a plurality of pressure-controlled sections, a master pressure controller for supplying a pressurized fluid having a reference pressure, a plurality of calibration chambers corresponding to the pressure controllers. The pressure control system further includes differential-pressure detecting devices provided in the calibration chambers to detect a differential pressure between the pressurized fluid supplied from the master pressure controller and the pressurized fluid supplied from the pressure controller, and an arithmetic device configured to receive a signal from the differential-pressure detecting device and adjust an output of the pressure controller so that the above differential pressure becomes zero or approximately zero.

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