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US Patent 6914509 Transformer former between two layout layers

Patent 6914509 was granted and assigned to VIA Technologies on July, 2005 by the United States Patent and Trademark Office.

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Is a
Patent
Patent
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Patent attributes

Patent Applicant
0
Current Assignee
VIA Technologies
VIA Technologies
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Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
69145090
Patent Inventor Names
Jay Yu0
Jimmy Hsu0
Nicole Li0
Date of Patent
July 5, 2005
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Patent Application Number
106105390
Date Filed
July 2, 2003
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Patent Citations Received
‌
US Patent 12002745 High performance integrated RF passives using dual lithography process
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Patent Primary Examiner
‌
Anh Mai
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Patent abstract

A printed circuit transformer includes a first wiring layer, a second wiring layer, a primary conductive coil including a first conductive trace, a second conductive trace, a third conductive trace, and a fourth conductive trace, which are on the first wiring layer or the second wiring layer, a first via plug, a second via plug, and a third via plug for connecting the ends of the conductive traces in the primary conductive coil, and a secondary conductive coil including a fifth conductive trace, a sixth conductive trace, a seventh conductive trace, and a eighth conductive trace, which are on the first wiring layer or the second wiring layer, a fourth via plug, a fifth via plug, and a sixth via plug for connecting the ends of the conductive traces in the secondary conductive coil.

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