Patent attributes
Cooling means are provided for directing cooling air over a desired portion of an electronic components card. A deflector attachable to the electronic components card for directing cooling air over the card is provided. The deflector is adapted to be moved with respect to the card to direct cooling air over different portions of the card. The deflector includes a scoop extending along the plane of the card and beyond the edge of the card when the deflector is attached to the card for redirecting cooling air over the card. The deflector can include a pair of walls having spaced apart interior surfaces forming a channel for receiving the card for attaching the deflector to the card. A method for cooling an electronic components card includes providing a deflector having a scoop for redirecting cooling air and attaching the deflector to the card so that the scoop directs cooling air over the card to cool the electronic components. The method includes attaching the deflector at a desired location along the card edge to direct air over a desired portion of the card.
