Is a
Patent attributes
Patent Applicant
0
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
R. Scott List0
Sarah E. Kim0
Date of Patent
June 21, 2005
0Patent Application Number
103289580
Date Filed
December 24, 2002
0Patent Citations Received
Patent Primary Examiner
Patent abstract
Methods for thinning wafer-to-wafer vertical stacks in the fabrication of stacked microelectronic devices. The methods include etching away unsupported portions of a wafer to be thinned in the vertical stack. The removal of the unsupported portions substantially eliminates potential cracking and chipping of the wafer, which can occur during the thinning process when the unsupported portions exist.
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